Semi Automatic MLCC Cutting Machine

YISENRONG semi automatic MLCC cutting machine is designed specifically for the cutting operation of chip - type components. It uses two sets of CCD as the visual alignment imaging system. By taking images through hardware and processing to determine the center point of the MARK as the basis for cutting. The entire cutting mechanism consists of the angle adjustment axis, platform movement axis, and cutter axis servo systems. The integration of the imaging system via PC software improves the cutting quality and efficiency. Manual loading and unloading and a pre - heating platform function are available.

The semi automatic MLCC cutting machine size for cutting relatively thick products can be customized and developed.

Maximum Equipment Dimensions: 1100mmW×1050mmD×2000mmH (including the three - color light)

Safety Precautions for Mechanical Equipment Operation:

A. Properly wear protective equipment.

B. Conduct equipment safety inspections.

C. Follow operating procedures and risk mitigation measures:

Do not touch moving parts (e.g., cutters, pulley wheels) with hands.

Do not adjust, measure, or clean debris by hand during operation.

For multi-person collaborative operations, clarify division of responsibilities to avoid accidental activation of control devices.

D. Equipment maintenance and emergency preparedness:

Perform regular maintenance and upkeep.

Clean equipment after use; inspect worn parts (e.g., cutters, bearings) and replace them promptly.

Regularly test safety devices (e.g., protective covers, emergency stop switches); unauthorized removal is prohibited.

E. Emergency response:

In case of sudden malfunction or accident, immediately cut off power and report the incident; do not attempt to repair equipment while it is running.

Delivery period: 90 days.