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Semi Automatic MLCC Cutting Machine
  • Semi Automatic MLCC Cutting MachineSemi Automatic MLCC Cutting Machine

Semi Automatic MLCC Cutting Machine

Model: Cutting Machine CTL - 501
The Semi Automatic MLCC Cutting Machine by YSR, a trusted manufacturer and supplier, is designed for precision cutting of chip ceramic capacitors, inductors, resistors, and more. Equipped with dual CCD imaging and a servo-driven cutting mechanism, it ensures high accuracy and efficiency. Customizable for thick products, this machine offers manual loading, pre-heating, and PC-integrated control for superior cutting quality.
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YISENRONG semi automatic MLCC cutting machine is designed specifically for the cutting operation of chip - type components. It uses two sets of CCD as the visual alignment imaging system. By taking images through hardware and processing to determine the center point of the MARK as the basis for cutting. The entire cutting mechanism consists of the angle adjustment axis, platform movement axis, and cutter axis servo systems. The integration of the imaging system via PC software improves the cutting quality and efficiency. Manual loading and unloading and a pre - heating platform function are available.


MLCC Cutting Machine


The semi automatic MLCC cutting machine size for cutting relatively thick products can be customized and developed.

Maximum Equipment Dimensions: 1100mmW×1050mmD×2000mmH (including the three - color light)



Safety Precautions for Mechanical Equipment Operation:

A. Properly wear protective equipment.

B. Conduct equipment safety inspections.

C. Follow operating procedures and risk mitigation measures:

Do not touch moving parts (e.g., cutters, pulley wheels) with hands.

Do not adjust, measure, or clean debris by hand during operation.

For multi-person collaborative operations, clarify division of responsibilities to avoid accidental activation of control devices.

D. Equipment maintenance and emergency preparedness:

Perform regular maintenance and upkeep.

Clean equipment after use; inspect worn parts (e.g., cutters, bearings) and replace them promptly.

Regularly test safety devices (e.g., protective covers, emergency stop switches); unauthorized removal is prohibited.

E. Emergency response:

In case of sudden malfunction or accident, immediately cut off power and report the incident; do not attempt to repair equipment while it is running.



Delivery period: 90 days.



Main advantage

1. To reduce the discrepancies caused by complete reliance on manual visual inspection and manual adjustment, we adopt a CCD vision system to identify product MARK marks, which can provide a positioning basis for the cutting position.

 

2. By controlling the Angle adjustment axis, platform movement axis and cutter axis through the servo system, and combining with PC software for image processing and motion control, it helps to achieve a more stable cutting process.

 

3. Operators can perform loading, unloading and necessary inspections according to product batches, while the equipment is responsible for the corresponding visual alignment and cutting actions. This approach offers a certain degree of flexibility for production scenarios involving multiple varieties, small batches, or those requiring manual inspection.


Compared with the general-purpose cutting equipment that is only for general materials, the dedicated MLCC cutting machine pays more attention to the positioning of ceramic blocks, cutting paths, workpiece fixation and blade status, and is suitable for the corresponding processing requirements of chip ceramic components.


FAQ


What are the applications of this equipment?

It is used in the MLCC production process, for the precise screening and classification of the grinding media (such as zirconium balls) used after the chamfering process, while also separating out non-conforming products such as product fragments and adhered materials. It ensures the dimensional accuracy and consistency of the grinding balls, and guarantees the electrical performance, reliability and yield rate of the MLCC products.

Why is a specialized steel ball screening machine needed for MLCC production? Can ordinary screening machines do the job?

MLCC production has extremely high requirements for the consistency of ball sizes at the micron or sub-micron level. Ordinary screening machines are difficult to achieve precise sorting within the ±0.01mm range, and are prone to clogging and rapid wear when handling small balls, unable to stably separate small fragments and adhered materials. Specialized screening machines are optimized in terms of screen mesh accuracy, anti-contamination design, and automation level, and are essential equipment to ensure product yield and performance.

How many people can this equipment save?

It can replace traditional manual screening or semi-automatic equipment, significantly reducing the number of operators, lowering labor intensity, and minimizing human errors.

Automatic feeding: Through a vibrating feeder or screw conveyor, the material is uniformly and stably fed into the screening system.

Automatic screening and grading: The core screening process is carried out according to the preset program.

Automatic collection and discharge: Balls of different particle sizes and waste materials are automatically discharged to designated containers through independent collection boxes or pneumatic valves.

Automatic control and monitoring: Using PLC or touch screen control systems, parameters can be preset, formulas can be stored, operation status can be monitored, faults can be alarmed, and even remote monitoring can be achieved.




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