Industry News

With advancements in 5G and AI technologies driving continuous improvements in semiconductor chip performance, thermal management requirements are becoming increasingly stringent.

With the increasing requirements for miniaturization and high reliability of devices in high-frequency fields such as 5G communications, vehicle-mounted radars, and microwave modules, LTCC (low-temperature co-fired ceramics) technology has become one of the key technologies in the field of electronic packaging due to its excellent electrical properties, stability, and integrability.

In modern indoor and outdoor decoration, the choice of wall materials is not only related to the visual effect, but also directly affects the comfort and maintenance cost of later use.

As consumer electronics products such as smartphones, tablets, and smart watches continue to be updated, the technical level of internal components is also continuously improving.